Board types and finishes


  • Single-Sided Rigid Boards
  • Double-Sided Rigid Boards with or without plated-through-holes
  • Multilayers up to 20 layers with normal as well as blind and/or buried vias
  • Single and Double-Sided Flexible Circuits
  • Multilayer RF/Microwave Boards


  • Standard Epoxy Glass NEMA grade FR4
  • Exotic Materials with higher maximum operating temperatures, lower co-efficients of expansion
  • and/or higher Tg levels.
  • RF/Microwave Materials including Teflon (Polytetrafluoroethylene-PTFE) and Duroid (Glass
  • Reinforced PTFE Composite), with capabilities of etching surface for improved bonding of
  • through-hole plating and solder mask coating.
  • Flexible polyimide films.


  • Hot Air Levelled
  • Solder Mask Over Bare Copper (SMOBC)
  • Gold Plated
  • Silver


  • Gold on Nickel Contact Fingers
  • CNC Routing
  • Scoring (V grooving)
  • Panel Routing
  • Screenprinted Component Legends
  • Liquid Photoimageable Solder Mask Inks (LPSM)
  • Dry Film Solder Mask (DFSM)/Conformask
  • Peelable Solder masks (for temporary protection from solder during wave soldering)
  • Screenprinted Conductive Inks (Carbon)
  • Bare Board Testing including Surface Mount Pads